CPC H01L 27/0629 (2013.01) [H01L 29/0653 (2013.01); H01L 29/4238 (2013.01)] | 20 Claims |
1. A semiconductor device, comprising:
a substrate comprising a non-doped region;
a first metal-oxide-semiconductor device extending into the substrate, wherein the first metal-oxide-semiconductor device is adjacent to the non-doped region in a first direction;
at least one first resistor coupled to the first metal-oxide-semiconductor device,
wherein the at least one first resistor is disposed right above the non-doped region in a second direction perpendicular to the first direction, and
the at least one first resistor is further arranged in a first row aligned with the first metal-oxide-semiconductor device in the first direction in a plan view of the semiconductor device;
a second metal-oxide-semiconductor device extending into the substrate, and separated from the first metal-oxide-semiconductor device along a third direction different from the first and second directions; and
at least one second resistor disposed right above the non-doped region and arranged in a second row aligned with the second metal-oxide-semiconductor device in the first direction.
|