US 12,080,700 B2
Microelectronic devices including control logic regions
Aaron S. Yip, Los Gatos, CA (US); Kunal R. Parekh, Boise, ID (US); and Akira Goda, Tokyo (JP)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Dec. 28, 2022, as Appl. No. 18/147,342.
Application 18/147,342 is a continuation of application No. 16/932,098, filed on Jul. 17, 2020, granted, now 11,587,919.
Prior Publication US 2023/0134814 A1, May 4, 2023
Int. Cl. H01L 25/18 (2023.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 25/18 (2013.01) [H01L 24/08 (2013.01); H01L 24/80 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2225/06524 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/14511 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A microelectronic device, comprising:
a first die comprising:
a memory array region comprising vertical strings of memory cells; and
a first control logic region comprising word line drivers; and
a second die attached to the first die, the second die comprising:
a second control logic region comprising banks of page buffers vertically offset and horizontally offset from the word line drivers.