US 12,080,695 B2
Method for manufacturing light emitting devices
Kenji Ozeki, Tokushima (JP); and Hiroki Fukuta, Anan (JP)
Assigned to NICHIA CORPORATION, Anan (JP)
Filed by NICHIA CORPORATION, Anan (JP)
Filed on Sep. 8, 2023, as Appl. No. 18/463,290.
Application 16/558,163 is a division of application No. 15/364,267, filed on Nov. 30, 2016, granted, now 10,461,065, issued on Oct. 29, 2019.
Application 18/463,290 is a continuation of application No. 17/837,028, filed on Jun. 10, 2022, granted, now 11,791,324.
Application 17/837,028 is a continuation of application No. 17/033,930, filed on Sep. 28, 2020, granted, now 11,393,803, issued on Jul. 19, 2022.
Application 17/033,930 is a continuation of application No. 16/558,163, filed on Sep. 2, 2019, granted, now 10,825,803, issued on Nov. 3, 2020.
Claims priority of application No. 2015-233593 (JP), filed on Nov. 30, 2015; and application No. 2016-032573 (JP), filed on Feb. 24, 2016.
Prior Publication US 2023/0420435 A1, Dec. 28, 2023
Int. Cl. H01L 25/16 (2023.01); H01L 23/00 (2006.01); H01L 23/24 (2006.01); H01L 25/07 (2006.01); H01L 25/075 (2006.01); H01L 27/02 (2006.01); H01L 29/866 (2006.01); H01L 33/00 (2010.01); H01L 33/50 (2010.01); H01L 33/52 (2010.01); H01L 33/54 (2010.01); H01L 33/56 (2010.01); H01L 33/58 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01)
CPC H01L 25/167 (2013.01) [H01L 24/26 (2013.01); H01L 24/73 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01L 33/0095 (2013.01); H01L 33/52 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H01L 23/24 (2013.01); H01L 25/072 (2013.01); H01L 25/0753 (2013.01); H01L 27/0248 (2013.01); H01L 29/866 (2013.01); H01L 33/505 (2013.01); H01L 33/62 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/26155 (2013.01); H01L 2224/26175 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/92225 (2013.01); H01L 2224/97 (2013.01); H01L 2924/12035 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/1304 (2013.01); H01L 2924/1426 (2013.01); H01L 2924/1811 (2013.01); H01L 2924/19105 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0091 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for manufacturing light emitting devices, the method comprising:
providing a substrate having a first region for forming a first light emitting device of the light emitting devices and a second region for forming a second light emitting device of the light emitting devices, the first light emitting device and the second light emitting device being axisymmetrical in plan view with respect to a boundary line extending between the first region and the second region;
mounting a first light emitting element on the substrate in the first region and a second light emitting element on the substrate in the second region;
arranging a first light transmissive member on the first light emitting element and a second light transmissive member on the second light emitting element; and
arranging a covering member to collectively cover at least a portion of the first light emitting device and at least a portion of the second light emitting device,
wherein the first light emitting device and the second light emitting device each have external connection terminals on upper surfaces thereof, the external connection terminals being exposed,
wherein the external connection terminals of the first light emitting device are provided on a side of the first light emitting device opposite to a side of the first light emitting device adjacent the boundary line in the plan view, and
wherein the external connection terminals of the second light emitting device are provided on a side of the second light emitting device opposite to a side of the second light emitting device adjacent the boundary line in the plan view.