US 12,080,688 B2
Light-emitting diode packaging module
Zhen-Duan Lin, Xiamen (CN); Yanqiu Liao, Xiamen (CN); Shuning Xin, Xiamen (CN); Weng-Tack Wong, Xiamen (CN); Junpeng Shi, Xiamen (CN); Aihua Cao, Xiamen (CN); Changchin Yu, Xiamen (CN); Chi-Wei Liao, Xiamen (CN); Chen-ke Hsu, Xiamen (CN); Zheng Wu, Xiamen (CN); and Chia-en Lee, Xiamen (CN)
Assigned to Quanzhou Sanan Semiconductor Technoogy Co., Ltd., Fujian (CN)
Filed by QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD., Quanzhou (CN)
Filed on Jan. 19, 2022, as Appl. No. 17/578,817.
Application 17/578,817 is a continuation in part of application No. PCT/CN2020/098501, filed on Jun. 28, 2020.
Claims priority of application No. 201921192783.2 (CN), filed on Jul. 26, 2019; and application No. 201921553490.2 (CN), filed on Sep. 18, 2019.
Prior Publication US 2022/0139890 A1, May 5, 2022
Int. Cl. H01L 25/075 (2006.01); H01L 33/38 (2010.01); H01L 33/54 (2010.01); H01L 33/62 (2010.01)
CPC H01L 25/0753 (2013.01) [H01L 33/38 (2013.01); H01L 33/54 (2013.01); H01L 33/62 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A light-emitting diode (LED) packaging module, comprising:
a plurality of LED chips that are spaced apart from one another, each of said LED chips including:
a chip first surface as a light-exiting surface,
a chip second surface opposite to said chip first surface,
a chip side surface that connects said chip first surface and said chip second surface, and
an electrode unit formed on said chip second surface;
a wiring layer that is disposed on said chip second surfaces of said LED chips, and that has a first wiring layer surface adjacent to said LED chips, a second wiring layer surface opposite to said first wiring layer surface, and a side wiring layer surface that is connected between said first wiring layer surface and said second wiring layer surface, said wiring layer being divided into a plurality of wiring parts that are spaced apart from each other, said first wiring layer surface contacting and being electrically connected to said electrode units of said LED chips; and
an encapsulant component including a first encapsulating layer that covers said chip side surface of each of said LED chips, and a second encapsulating layer that covers said side wiring layer surface of said wiring layer and that fills gaps among said wiring parts,
wherein
each of said LED chips has a thickness TA, said first encapsulating layer has a thickness TB, and TA and TB satisfy a relationship: TB/TA≥1.