CPC H01L 25/0657 (2013.01) [H01L 21/563 (2013.01); H01L 21/566 (2013.01); H01L 21/76898 (2013.01); H01L 23/3128 (2013.01); H01L 23/481 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 24/32 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/02373 (2013.01); H01L 2224/02381 (2013.01); H01L 2924/1434 (2013.01)] | 20 Claims |
1. A method comprising:
forming a stacked structure, wherein forming the stacked structure comprising:
stacking a plurality of device dies as a die stack;
forming a plurality of through-vias, with overlying ones of the plurality of through-vias being electrically connecting to respective underlying ones of the plurality of through-vias;
forming a plurality of encapsulant regions, each encapsulating one of the plurality of device dies; and
forming a plurality of redistribution structures, each overlying and contacting one of the plurality of encapsulant regions, a corresponding one of the plurality of device dies, and a corresponding one of the plurality of through-vias, wherein the plurality of redistribution structures comprise a redistribution line comprising a first via physically contacting a metal pad of a device die in the plurality of device dies, and a second via physically contacting one of the plurality of through-vias; and
electrically connecting the stacked structure to a bottom die, wherein each of the plurality of device dies is electrically connected to the bottom die through the plurality of through-vias and corresponding ones of the plurality of redistribution structures.
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