US 12,080,679 B2
Bonding apparatus and alignment method
Toru Maeda, Tokyo (JP); and Osamu Kakutani, Tokyo (JP)
Assigned to SHINKAWA LTD., Tokyo (JP)
Appl. No. 18/010,458
Filed by SHINKAWA LTD., Tokyo (JP)
PCT Filed Aug. 26, 2021, PCT No. PCT/JP2021/031360
§ 371(c)(1), (2) Date Dec. 15, 2022,
PCT Pub. No. WO2023/026430, PCT Pub. Date Mar. 2, 2023.
Prior Publication US 2024/0105673 A1, Mar. 28, 2024
Int. Cl. B23K 20/00 (2006.01); B23K 20/10 (2006.01); H01L 23/00 (2006.01); B23K 101/40 (2006.01)
CPC H01L 24/78 (2013.01) [B23K 20/004 (2013.01); B23K 20/005 (2013.01); B23K 20/106 (2013.01); B23K 2101/40 (2018.08); H01L 2224/78621 (2013.01); H01L 2224/78701 (2013.01); H01L 2224/78753 (2013.01)] 4 Claims
OG exemplary drawing
 
1. An alignment method for aligning a horn and a clamper of a bonding apparatus with each other,
the bonding apparatus comprising:
the clamper, able to clamp a wire between a pair of arms;
the horn, in which a first through hole able to hold a bonding tool, and a second through hole adjacent to the first through hole and penetrating the horn in an up-down direction are further formed; and
a bonding stage, able to carry a workpiece,
wherein the alignment method comprises:
disposing a mirror surface to be parallel to the bonding stage;
aligning a mirror image of the second through hole reflected on the mirror surface with a center of the second through hole when the mirror surface is viewed through the second through hole; and
aligning the clamper based on a position of the mirror image and the horn.