US 12,080,677 B2
Board unit and semiconductor device
Katsuya Murakami, Sumida Tokyo (JP)
Assigned to Kioxia Corporation, Tokyo (JP)
Filed by Kioxia Corporation, Tokyo (JP)
Filed on Mar. 14, 2022, as Appl. No. 17/693,886.
Claims priority of application No. 2021-152927 (JP), filed on Sep. 21, 2021.
Prior Publication US 2023/0086136 A1, Mar. 23, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 25/065 (2023.01); H05K 1/11 (2006.01)
CPC H01L 24/73 (2013.01) [H01L 24/13 (2013.01); H01L 24/48 (2013.01); H01L 25/0657 (2013.01); H05K 1/111 (2013.01); H01L 2224/13021 (2013.01); H01L 2224/13028 (2013.01); H01L 2224/48491 (2013.01); H01L 2224/73207 (2013.01); H01L 2224/73257 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06562 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A board unit comprising:
a circuit board;
a semiconductor device having a bottom surface facing the circuit board, the semiconductor device including a plurality of bonding members, the plurality of the bonding members being between the circuit board and the bottom surface, the plurality of the bonding members being connected to the circuit board; and
a wire between the circuit board and the bottom surface, wherein
the plurality of the bonding members have a first row and a second row,
of the plurality of the bonding members, two or more bonding members align in the first row in a first direction,
of the plurality of the bonding members, two or more bonding members align in the second row in the first direction,
the second row is apart from the first row in a second direction intersecting with the first direction,
the wire includes a first portion between the first row and the second row, and
the wire has a strength higher than that of one of the plurality of the bonding members.