US 12,080,671 B2
Layered bonding material, semiconductor package, and power module
Naoto Kameda, Tokyo (JP); Kanta Dei, Tokyo (JP); and Masato Tsuchiya, Tokyo (JP)
Assigned to SENJU METAL INDUSTRY CO., LTD., Tokyo (JP)
Appl. No. 18/288,636
Filed by SENJU METAL INDUSTRY CO., LTD., Tokyo (JP)
PCT Filed Apr. 18, 2022, PCT No. PCT/JP2022/017980
§ 371(c)(1), (2) Date Oct. 27, 2023,
PCT Pub. No. WO2022/230697, PCT Pub. Date Nov. 3, 2022.
Claims priority of application No. 2021-076312 (JP), filed on Apr. 28, 2021.
Prior Publication US 2024/0213206 A1, Jun. 27, 2024
Int. Cl. H01L 23/00 (2006.01); B23K 1/00 (2006.01); B23K 101/40 (2006.01); B23K 103/12 (2006.01); B23K 103/16 (2006.01); B32B 15/01 (2006.01)
CPC H01L 24/29 (2013.01) [B23K 1/0016 (2013.01); B32B 15/01 (2013.01); H01L 24/32 (2013.01); B23K 2101/40 (2018.08); B23K 2103/12 (2018.08); B23K 2103/166 (2018.08); H01L 2224/29083 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/29155 (2013.01); H01L 2224/2918 (2013.01); H01L 2224/29184 (2013.01); H01L 2224/32225 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A layered bonding material comprising:
a base material;
a first solder section stacked on a first surface of the base material; and
a second solder section stacked on a second surface of the base material, wherein
a coefficient of linear expansion of the base material is 5.5 to 15.5 ppm/K,
the first solder section and the second solder section are made of lead-free solder, and
both of a thickness of the first solder section and a thickness of the second solder section are 0.05 to 1.0 mm.