US 12,080,667 B2
Conductive terminal for side facing packages
Rafael Jose Lizares Guevara, Makati (PH); and Jose Arvin Matute Plomantes, Dagupan (PH)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed on Feb. 22, 2022, as Appl. No. 17/677,624.
Prior Publication US 2023/0268302 A1, Aug. 24, 2023
Int. Cl. H01L 23/00 (2006.01)
CPC H01L 24/13 (2013.01) [H01L 24/11 (2013.01); H01L 24/16 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/11515 (2013.01); H01L 2224/11618 (2013.01); H01L 2224/11622 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/13005 (2013.01); H01L 2224/13011 (2013.01); H01L 2224/13017 (2013.01); H01L 2224/13019 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13541 (2013.01); H01L 2224/13566 (2013.01); H01L 2224/1357 (2013.01); H01L 2224/16058 (2013.01); H01L 2224/16059 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/16238 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a semiconductor die having a first side, a second side, and a conductive terminal, the second side orthogonal to the first side, the conductive terminal on the first side, and the conductive terminal having a center that is spaced apart from the second side by a first distance along a direction; and
a solder structure abutting the conductive terminal, the solder structure having a center that is spaced apart from the center of the conductive terminal by a non-zero second distance along the direction.