US 12,080,660 B2
Package with different types of semiconductor dies attached to a flange
Xikun Zhang, Shanghai (CN); Dejiang Chang, Shanghai (CN); Bill Agar, Morgan Hill, CA (US); Michael Lefevre, Morgan Hill, CA (US); and Alexander Komposch, Morgan Hill, CA (US)
Assigned to MACOM Technology Solutions Holdings, Inc., Lowell, MA (US)
Filed by CREE, INC., Durham, NC (US)
Filed on Apr. 13, 2021, as Appl. No. 17/228,978.
Application 17/228,978 is a division of application No. 15/973,276, filed on May 7, 2018, granted, now 11,004,808.
Application 15/973,276 is a continuation of application No. 14/928,812, filed on Oct. 30, 2015, granted, now 9,997,476, issued on Jun. 12, 2018.
Prior Publication US 2021/0233877 A1, Jul. 29, 2021
Int. Cl. H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 25/00 (2006.01); H01L 25/07 (2006.01); H01L 29/16 (2006.01)
CPC H01L 23/66 (2013.01) [H01L 23/49503 (2013.01); H01L 23/49568 (2013.01); H01L 23/49575 (2013.01); H01L 23/49844 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 24/95 (2013.01); H01L 25/072 (2013.01); H01L 25/50 (2013.01); H01L 29/16 (2013.01); H01L 23/49534 (2013.01); H01L 23/49537 (2013.01); H01L 23/49582 (2013.01); H01L 23/49586 (2013.01); H01L 24/29 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 2223/6644 (2013.01); H01L 2223/6672 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83121 (2013.01); H01L 2224/83136 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83855 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/014 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/19041 (2013.01)] 26 Claims
OG exemplary drawing
 
1. A multi-die package, comprising:
a thermally conductive flange;
a first semiconductor die made of a first semiconductor material attached to the thermally conductive flange via a first die attach material;
a second semiconductor die made of a second semiconductor material different than the first semiconductor material and attached to the same thermally conductive flange as the first semiconductor die via a second die attach material; and
a circuit board attached to the thermally conductive flange, the circuit board comprising a plurality of metal traces which form leads configured to provide external electrical access to the first and second semiconductor dies, and the circuit board comprising a plurality of openings,
wherein the first and second semiconductor dies are attached to the thermally conductive flange through separate ones of the plurality of openings.