US 12,080,657 B2
Die embedded in substrate with stress buffer
Jefferson Sismundo Talledo, Calamba (PH)
Assigned to STMicroelectronics, Inc., Calamba (PH)
Filed by STMicroelectronics, Inc., Calamba (PH)
Filed on Feb. 13, 2023, as Appl. No. 18/168,319.
Application 18/168,319 is a continuation of application No. 17/221,374, filed on Apr. 2, 2021, granted, now 11,610,851.
Claims priority of provisional application 63/017,486, filed on Apr. 29, 2020.
Prior Publication US 2023/0187384 A1, Jun. 15, 2023
Int. Cl. H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/562 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/6835 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 2221/68372 (2013.01); H01L 2224/214 (2013.01); H01L 2924/351 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A device, comprising:
a substrate including:
a first surface;
a second surface opposite to the first surface;
at least one first sidewall transverse to the first surface and the second surface, and the at least one first sidewall extends from the first surface to the second surface;
a first opening extending through the substrate from the first surface to the second surface, and the first opening is delimited by the at least first one sidewall;
a first elastomer integrally formed in the first opening and continuously extends from the first surface to the second surface; and
a first die suspended within the first elastomer, the first die is suspended between the first surface and the second surface of the substrate by the first elastomer, the first die including:
a third surface spaced inward from the first surface of the substrate;
a fourth surface opposite to the third surface, and the fourth surface is spaced inward from the second surface of the substrate; and
at least one second sidewall transverse to the third surface and the fourth surface and the at least one second sidewall extends from the third surface to the fourth surface and is spaced inward from the at least one first sidewall, and
wherein the first elastomer is integrally formed on the third surface, the fourth surface, and the at least one second sidewall of the die.