| CPC H01L 23/5385 (2013.01) [H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 25/00 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/1703 (2013.01)] | 20 Claims |
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1. A microelectronic assembly, comprising:
a package substrate;
a first die, a second die, a third die and a fourth die in a first plane above the package substrate;
a fifth die in a second plane above the first plane, the fifth die having a first side and a second side laterally opposite the first side, the fifth die vertically overlapping the first die and the second die at the first side, and the fifth die vertically overlapping the third die and the fourth die at the second side;
a sixth die in the second plane, the sixth die vertically overlapping with the first die, the sixth die at the first side of the fifth die;
a seventh die in the second plane, the seventh die vertically overlapping with the second die, the seventh die at the first side of the fifth die;
an eighth die in the second plane, the eighth die vertically overlapping with the third die, the eighth die at the second side of the fifth die;
a ninth die in the second plane, the ninth die vertically overlapping with the fourth die, the ninth die at the second side of the fifth die;
a first interconnect vertically between the fifth die and the package substrate, the first interconnect laterally between the first die and the third die; and
a second interconnect vertically between the eighth die and the package substrate, the second interconnect laterally spaced apart from the third die.
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