US 12,080,647 B2
Integrated circuit, system and method of forming the same
Guo-Huei Wu, Hsinchu (TW); Pochun Wang, Hsinchu (TW); Wei-Hsin Tsai, Hsinchu (TW); Chih-Liang Chen, Hsinchu (TW); and Li-Chun Tien, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed on Dec. 14, 2022, as Appl. No. 18/065,963.
Application 18/065,963 is a continuation of application No. 17/195,868, filed on Mar. 9, 2021, granted, now 11,569,168.
Claims priority of provisional application 63/024,972, filed on May 14, 2020.
Prior Publication US 2023/0114558 A1, Apr. 13, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/528 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 27/092 (2006.01)
CPC H01L 23/5286 (2013.01) [H01L 21/768 (2013.01); H01L 23/5226 (2013.01); H01L 27/092 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated circuit comprising:
a first power rail on a back-side of a substrate, extending in a first direction, and configured to supply a first supply voltage;
a first active region of a first set of transistors, the first active region extending in the first direction, and being on a first level of a front-side of the substrate opposite from the back-side;
a second active region of a second set of transistors, the second active region extending in the first direction, being on the first level of the front-side of the substrate, and being separated from the first active region in a second direction different from the first direction;
a conductive structure on the back-side of the substrate, extending in the first direction, and being electrically coupled to the first active region and the second active region;
a first contact extending in the second direction, overlapping the first active region, and being located on a second level different from the first level; and
a second contact extending in the second direction, overlapping the second active region, being located on the second level, and being electrically coupled to the first contact.