US 12,080,637 B2
Through-hole electrode substrate
Satoru Kuramochi, Tokyo (JP); Sumio Koiwa, Tokyo (JP); and Hidenori Yoshioka, Tokyo (JP)
Assigned to Dai Nippon Printing Co., Ltd., Tokyo (JP)
Filed by Dai Nippon Printing Co., Ltd., Tokyo (JP)
Filed on Apr. 21, 2022, as Appl. No. 17/725,627.
Application 17/725,627 is a continuation of application No. 16/936,519, filed on Jul. 23, 2020, granted, now 11,362,028.
Application 16/936,519 is a continuation of application No. 16/743,145, filed on Jan. 15, 2020, granted, now 10,790,221, issued on Sep. 29, 2020.
Application 16/743,145 is a continuation of application No. 16/266,203, filed on Feb. 4, 2019, granted, now 10,580,727, issued on Mar. 3, 2020.
Application 16/266,203 is a continuation of application No. 15/159,323, filed on May 19, 2016, granted, now 10,256,176, issued on Apr. 9, 2019.
Application 15/159,323 is a continuation of application No. PCT/JP2014/080649, filed on Nov. 19, 2014.
Claims priority of application No. 2013-241392 (JP), filed on Nov. 21, 2013.
Prior Publication US 2022/0246512 A1, Aug. 4, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/498 (2006.01); H01L 23/48 (2006.01); H01L 25/065 (2023.01); H01L 25/18 (2023.01); H05K 1/11 (2006.01); H05K 3/28 (2006.01); H05K 3/44 (2006.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 23/15 (2006.01)
CPC H01L 23/49827 (2013.01) [H01L 23/481 (2013.01); H01L 23/49894 (2013.01); H01L 25/065 (2013.01); H01L 25/18 (2013.01); H05K 1/115 (2013.01); H05K 3/28 (2013.01); H05K 3/445 (2013.01); H01L 23/13 (2013.01); H01L 23/15 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16165 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73257 (2013.01); H01L 2224/81805 (2013.01); H01L 2224/8385 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06572 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1432 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/15788 (2013.01); H01L 2924/1579 (2013.01); H01L 2924/381 (2013.01); H05K 2201/09154 (2013.01); H05K 2201/09563 (2013.01); H05K 2201/09581 (2013.01); H05K 2201/0959 (2013.01); H05K 2201/09854 (2013.01); H05K 2203/0594 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A through-hole electrode substrate comprising:
a substrate including a through-hole extending from a first aperture of a first surface to a second aperture of a second surface, an area of the second aperture being larger than an area of the first aperture, the through-hole having a minimum aperture part between the first aperture and the second aperture, an area of the minimum aperture part being the smallest among a plurality of areas of the through-hole in a planar view;
a first member arranged within the through-hole; and
an insulating resin layer contacting the first member exposed to one of the first surface and the second surface.