US 12,080,634 B2
Semiconductor device, printed circuit board (PCB), and method of interfacing control pin (gate pin) of a power semiconductor device (MOSFET) to a printed circuit board (PCB)
James P. McBride, Phoenix, AZ (US); and James Richard Stanfield, Glendale, AZ (US)
Assigned to The Noco Company, Glenwillow, OH (US)
Appl. No. 17/756,556
Filed by THE NOCO COMPANY, Glenwillow, OH (US)
PCT Filed Nov. 25, 2020, PCT No. PCT/US2020/062417
§ 371(c)(1), (2) Date May 26, 2022,
PCT Pub. No. WO2021/108706, PCT Pub. Date Jun. 3, 2021.
Application 17/756,556 is a continuation in part of application No. 29/715,103, filed on Nov. 27, 2019, granted, now D920264, issued on May 25, 2021.
Application 17/756,556 is a continuation in part of application No. 29/715,105, filed on Nov. 27, 2019, granted, now D932452, issued on Oct. 5, 2021.
Claims priority of provisional application 62/941,275, filed on Nov. 27, 2019.
Prior Publication US 2022/0399256 A1, Dec. 15, 2022
Int. Cl. H05K 1/18 (2006.01); H01L 23/495 (2006.01); H01M 10/42 (2006.01); H01M 50/519 (2021.01); H05K 1/14 (2006.01); H05K 3/34 (2006.01); H01L 25/11 (2006.01)
CPC H01L 23/49555 (2013.01) [H01L 23/49562 (2013.01); H01M 10/4257 (2013.01); H01M 50/519 (2021.01); H05K 1/141 (2013.01); H05K 1/181 (2013.01); H05K 3/3426 (2013.01); H01L 25/115 (2013.01); H01M 2010/4271 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/10628 (2013.01); H05K 2201/10659 (2013.01); H05K 2201/10757 (2013.01); H05K 2201/10818 (2013.01); H05K 2203/049 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A MOSFET device for use with a printed circuit board (PCB), the device comprising:
a semiconductor body;
a metal conductor extending outwardly from a side of the semiconductor body;
a plurality of power pins extending outwardly from at least one side of the semiconductor body, the power pins having tips bent downwardly and electrically connected to one or more spaced apart copper plates;
a gate pin extending outwardly from at least one side of the semiconductor body,
wherein the tip of the gate pin is elevated relative to the tips of the power pins so as to avoid electrical contact with the one or more spaced apart copper plates, and
wherein the tip of the gate pin is connected to one of a plurality of soldering tabs or soldering areas on a gate printed circuit board, the gate printed circuit board elevated relative to the spaced apart copper plates.