US 12,080,632 B2
Glass core package substrates
Deepak Vasant Kulkarni, Santa Clara, CA (US); Rahul Agarwal, Santa Clara, CA (US); Rajasekaran Swaminathan, Austin, TX (US); and Chintan Buch, Austin, TX (US)
Assigned to Advanced Micro Devices, Inc., Santa Clara, CA (US)
Filed by Advanced Micro Devices, Inc., Santa Clara, CA (US)
Filed on Sep. 29, 2021, as Appl. No. 17/489,182.
Prior Publication US 2023/0102183 A1, Mar. 30, 2023
Int. Cl. H01L 23/495 (2006.01); H01L 23/14 (2006.01); H10B 12/00 (2023.01)
CPC H01L 23/4951 (2013.01) [H01L 23/145 (2013.01); H10B 12/50 (2023.02)] 13 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a first glass package substrate comprising:
redistribution layers between a first integrated circuit and a first side of a first glass wafer; and
bump pads directly placed on:
pads of a motherboard; and
a second side different than the first side of the first glass wafer; and
wherein responsive to a potential being applied to a first node of one of the first integrated circuit and a first component on the motherboard, a current is conveyed from the first node to a second node through the first glass package substrate.