| CPC H01L 23/485 (2013.01) [H01L 21/561 (2013.01); H01L 23/3107 (2013.01)] | 19 Claims |
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1. A device, comprising:
a first layer of resin having a first laser activated additive material that becomes conductive when exposed to a laser, the first layer having a first thickness, the first layer having a first surface and a second surface opposite to the first surface, and the first layer has a first sidewall;
a die on the second surface of the first layer;
a second layer of resin having a second laser activated additive material that becomes conductive when exposed to the laser, the second layer of resin is on the second surface of the first layer of resin, the second layer covers the die, the second layer having a third surface facing away from the first layer, the second layer having a second thickness extending from the second surface to the third surface, and the second layer has a second sidewall substantially coplanar with the first sidewall;
a lead exposed from the first surface of the first layer, and the lead has a third sidewall substantially coplanar with the first and second sidewalls, respectively;
a first conductive via extending from the lead to the third surface of the second layer;
a second conductive via extending into the third surface of the second layer to the die;
a bus bar extending from the first conductive via to the second conductive via, the bus bar coupling the first conductive via to the second conductive via; and
a third layer of resin on the third surface of the second layer, the third layer covers respective surfaces of the bus bar, the first conductive via, and the second conductive via, respectively, exposed from the third surface of the second layer, the third layer having a third thickness less than the first thickness and less than the second thickness, and the third layer includes a fourth sidewall substantially coplanar with the first, second, and third sidewall, respectively.
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