US 12,080,627 B1
Thermal management device for high heat flux applications including a microchannel heat sink assembly and method for manufacturing the same
Essam Mohamed, Sharjah (AE); and Chaouki Ghenai, Sharjah (AE)
Assigned to University of Sharjah, Sharjah (AE)
Filed by University of Sharjah, Sharjah (AE)
Filed on Feb. 17, 2023, as Appl. No. 18/171,020.
Int. Cl. H01L 23/473 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/473 (2013.01) [H01L 21/4882 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/29193 (2013.01); H01L 2224/32245 (2013.01); H01L 2924/01006 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A thermal management device for high heat flux application in a microelectronic device by extracting excess heat from the microelectronic device, wherein the thermal management device comprising:
an integrated board;
a microelectronic chip associated with the integrated board;
a thermal interface material component coupled to the microelectronic chip for providing uniform cooling; and
a microchannel heat sink assembly operatively connected to the thermal interface material component for transferring thermal energy from the integrated board material B and the microelectronic chip to the thermal interface material component, wherein the microchannel heat sink assembly comprises a housing with at least two inlets and at least two outlets, an adiabatic wall configured to allow heat to pass across the microchannel heat sink assembly, a plurality of flow channels of varying width adapted for increasing a heat transfer rate along a flow stream and a metal mesh inserted within a streamline of the plurality of flow channels.