US 12,080,626 B1
System and method for providing direct silicon footprint microfluidic cooling for electronics
Luis Daniel Lorenzini Gutierrez, Atlanta, GA (US); and Yogendra Joshi, Atlanta, GA (US)
Assigned to Georgia Tech Research Corporation, Atlanta, GA (US)
Filed by Georgia Tech Research Corporation, Atlanta, GA (US)
Filed on Feb. 13, 2020, as Appl. No. 16/789,824.
Claims priority of provisional application 62/805,119, filed on Feb. 13, 2019.
Int. Cl. H01L 23/473 (2006.01); F28F 3/02 (2006.01); H01L 23/00 (2006.01); H01L 23/40 (2006.01); H05K 7/20 (2006.01)
CPC H01L 23/473 (2013.01) [F28F 3/02 (2013.01); H01L 23/4006 (2013.01); H01L 24/32 (2013.01); H05K 7/20254 (2013.01); H05K 7/20272 (2013.01); H01L 2023/405 (2013.01); H01L 2023/4087 (2013.01); H01L 24/16 (2013.01); H01L 24/73 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73253 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A system for providing direct electronic component cooling, comprising:
a plurality of electronic components, wherein each of the plurality of electronic components comprises:
a cooling block comprising a first side and a second side;
a plurality of micro-pin fins disposed on the first side of the cooling block, the plurality of micro-pin fins defining a first surface area on the first side of the cooling block;
a thermal interface material layer contacting the second side of the cooling block, the thermal interface material layer also contacting an electronic component, the electronic component defines a second surface area; and
a manifold coupled to the cooling block and facing the plurality of micro-pin fins, wherein the manifold comprises an inlet port and an outlet port for supporting a cooling fluid flowing between the inlet port and the outlet port, the cooling fluid from the inlet port and the outlet port also flowing between the plurality of micro-pin fins for removing heat from the plurality of micro-pin fins collected by the cooling block from the thermal interface layer;
a fluid gasket sandwiched between the manifold and the first side of the cooling block, the fluid gasket outlining the first surface area such that the fluid gasket has a geometry and size that matches a perimeter geometry defined by micro-pin fins at edges of the first surface area, the fluid gasket providing a tight fluid seal that encloses the first surface area containing the plurality of micro-pin fins which is actively cooled by the cooling fluid;
the first surface area defined by the plurality of micro-pin fins on the first side of the cooling block is equal to the second surface area defined by the electronic component in both size and geometry, such that the system provides a compact cooling solution for the electronic component.