US 12,080,618 B2
Electronic package, heat dissipation structure and manufacturing method thereof
Yu-Lung Huang, Taichung (TW); Kuo-Hua Yu, Taichung (TW); and Chang-Fu Lin, Taichung (TW)
Assigned to SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed by SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung (TW)
Filed on Jan. 25, 2022, as Appl. No. 17/583,946.
Claims priority of application No. 110118681 (TW), filed on May 24, 2021.
Prior Publication US 2022/0375813 A1, Nov. 24, 2022
Int. Cl. H01L 23/48 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/3675 (2013.01) [H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/29109 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29191 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29291 (2013.01); H01L 2224/293 (2013.01); H01L 2224/29393 (2013.01); H01L 2224/32221 (2013.01); H01L 2924/0635 (2013.01)] 27 Claims
OG exemplary drawing
 
1. A heat dissipation structure, comprising:
a heat dissipation body having a first side and a second side opposite to each other, and a carrying area and an active area adjacent to the carrying area are defined on a surface of the first side, wherein the carrying area is used for applying a first heat dissipation material thereonto;
an adjustment channel formed in the active area, wherein one end of the adjustment channel communicates with outside of the heat dissipation structure, and the other end of the adjustment channel communicates with the carrying area to adjust a volume of the first heat dissipation material; and
a buffer channel formed in the active area and in communication with the adjustment channel, wherein the first heat dissipation material is filled into the buffer channel after being pressed.