US 12,080,615 B2
Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors
Chen-Hua Yu, Hsinchu (TW); Kuo-Chung Yee, Taoyuan (TW); Hao-Yi Tsai, Hsinchu (TW); and Tin-Hao Kuo, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsin-Chu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Dec. 19, 2022, as Appl. No. 18/068,010.
Application 18/068,010 is a continuation of application No. 16/390,482, filed on Apr. 22, 2019, granted, now 11,532,529.
Application 16/390,482 is a continuation of application No. 16/053,133, filed on Aug. 2, 2018, granted, now 10,269,674, issued on Apr. 23, 2019.
Application 16/053,133 is a continuation of application No. 15/004,240, filed on Jan. 22, 2016, granted, now 10,049,953, issued on Aug. 14, 2018.
Claims priority of provisional application 62/221,443, filed on Sep. 21, 2015.
Prior Publication US 2023/0123427 A1, Apr. 20, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2023.01); H01L 21/56 (2006.01)
CPC H01L 23/3114 (2013.01) [H01L 21/486 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H01L 24/94 (2013.01); H01L 24/97 (2013.01); H01L 25/0652 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 23/295 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/14181 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16265 (2013.01); H01L 2224/214 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/24147 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73217 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/9222 (2013.01); H01L 2224/92244 (2013.01); H01L 2224/94 (2013.01); H01L 2224/97 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/18162 (2013.01); H01L 2924/19041 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A package comprising:
a lid;
a thermal interface material over and contacting the lid;
a first device die and a second device die over the thermal interface material;
a first encapsulant encapsulating the first device die and the second device die therein;
a first die-attach film comprising a first bottom surface contacting a first top surface of the first device die and a second top surface of the second device die;
a third device die comprising a second bottom surface adhered to a third top surface of the first die-attach film;
a second encapsulant encapsulating the third device die therein;
a first through-via penetrating through the second encapsulant; and
a redistribution structure over and electrically coupling to the first device die, the second device die, and the third device die.