CPC H01L 23/3114 (2013.01) [H01L 21/486 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H01L 24/94 (2013.01); H01L 24/97 (2013.01); H01L 25/0652 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 23/295 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/14181 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16265 (2013.01); H01L 2224/214 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/24147 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73217 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/9222 (2013.01); H01L 2224/92244 (2013.01); H01L 2224/94 (2013.01); H01L 2224/97 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/18162 (2013.01); H01L 2924/19041 (2013.01)] | 12 Claims |
1. A package comprising:
a lid;
a thermal interface material over and contacting the lid;
a first device die and a second device die over the thermal interface material;
a first encapsulant encapsulating the first device die and the second device die therein;
a first die-attach film comprising a first bottom surface contacting a first top surface of the first device die and a second top surface of the second device die;
a third device die comprising a second bottom surface adhered to a third top surface of the first die-attach film;
a second encapsulant encapsulating the third device die therein;
a first through-via penetrating through the second encapsulant; and
a redistribution structure over and electrically coupling to the first device die, the second device die, and the third device die.
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