CPC H01L 23/29 (2013.01) [H01L 23/367 (2013.01); H01L 23/40 (2013.01); H01L 23/552 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01)] | 19 Claims |
1. An electronic component module comprising:
a substrate including a first main surface and a second main surface that opposes each other;
a first electronic component mounted on the first main surface of the substrate and configured to generate heat;
a heat dissipating member that overlaps the first electronic component in a plan view of the first main surface of the substrate; and
a first sealing resin that covers the first main surface and the first electronic component and that includes a portion in contact with the heat dissipating member;
wherein the heat dissipating member includes:
a main body disposed opposite to the substrate with respect to the first electronic component; and
an auxiliary portion connected to an outer peripheral of the main body and that protrudes from the main body toward the substrate, with the auxiliary portion including:
a root connected to the main body, and
a tip on an opposite side of the root,
wherein at least a portion of the tip of the auxiliary portion is connected to the substrate, and
wherein the auxiliary portion, in a plan view of the main body, tilts so that a position of at least the portion of the tip is more inside the main body than a position of the root.
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