US 12,080,610 B2
Wavelet system and method for ameliorating misregistration and asymmetry of semiconductor devices
Lilach Saltoun, Qiriat Ono (IL); and Daria Negri, Nesher (IL)
Assigned to KLA Corporation, Milpitas, CA (US)
Appl. No. 17/044,963
Filed by KLA CORPORATION, Milpitas, CA (US)
PCT Filed Sep. 4, 2020, PCT No. PCT/US2020/049297
§ 371(c)(1), (2) Date Oct. 2, 2020,
PCT Pub. No. WO2021/262208, PCT Pub. Date Dec. 30, 2021.
Claims priority of provisional application 63/043,828, filed on Jun. 25, 2020.
Prior Publication US 2022/0020649 A1, Jan. 20, 2022
Int. Cl. G03F 7/00 (2006.01); G01B 15/00 (2006.01); H01L 21/66 (2006.01)
CPC H01L 22/20 (2013.01) [G01B 15/00 (2013.01); G03F 7/70633 (2013.01); G03F 7/70655 (2023.05); G03F 7/706837 (2023.05)] 21 Claims
OG exemplary drawing
 
1. A wavelet-analysis system for use in fabricating semiconductor device wafers, the system comprising:
a misregistration metrology tool operative to measure at least one measurement site on a wafer, thereby generating an output signal; and
a wavelet-based analysis engine operative to:
generate at least one wavelet-transformed signal by applying at least one wavelet transformation to said output signal; and
generate a quality metric by analyzing said wavelet-transformed signal, wherein said analyzing comprises associating particular portions of said wavelet-transformed signal with particular locations within said measurement site, and wherein said analyzing further associates contributions of one or more structures formed within said measurement site to said quality metric.