US 12,080,587 B2
Apparatus for preventing backside peeling defects on semiconductor wafers
Yen-Yu Chen, Taichung (TW); Wei-Jen Chen, Taichung (TW); Yi-Chen Chiang, Taichung (TW); Tsang-Yang Liu, Changhua County (TW); Chang-Sheng Lee, Hsinchu (TW); Wei-Chen Liao, Nantou County (TW); and Wei Zhang, Hsinchu County (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed on Aug. 14, 2020, as Appl. No. 16/994,400.
Application 16/230,765 is a division of application No. 13/929,297, filed on Jun. 27, 2013, granted, now 10,163,676, issued on Dec. 25, 2018.
Application 16/994,400 is a continuation of application No. 16/230,765, filed on Dec. 21, 2018, granted, now 10,748,806.
Prior Publication US 2020/0381287 A1, Dec. 3, 2020
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/687 (2006.01)
CPC H01L 21/68742 (2013.01) 20 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a susceptor having a wafer support surface and a hole extending downwards from the wafer support surface of the susceptor;
a lift pin movably received in the hole of the susceptor;
a lift pin head coupled with the lift pin and having a lower portion and an upper portion, wherein the upper portion of the lift pin head has a bottom surface extending laterally from a top end of a sidewall of the lower portion of the lift pin head, a top surface opposite to the bottom surface of the upper portion of the lift pin head, a sidewall extending downwards from the top surface of the upper portion of the lift pin head, and first and second cut portions extending from the bottom surface of the upper portion of the lift pin head to the sidewall of the upper portion of the lift pin head, wherein a surface of the first cut portion and a surface of the second cut portion are slanted toward different directions with respect to the bottom surface of the upper portion of the lift pin head, and wherein the first cut portion further extends to the top surface of the lift pin head, while a top end of the second cut portion is separated from the top surface of the lift pin head; and
a non-reactive gas source in fluid communication with the hole of the susceptor.