| CPC H01L 21/6835 (2013.01) [H01L 25/0753 (2013.01); H01L 33/50 (2013.01); H01L 33/52 (2013.01); H01L 33/62 (2013.01); H01L 2221/68309 (2013.01); H01L 2221/68313 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68368 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0066 (2013.01)] | 24 Claims |
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1. A wet alignment method for a micro-semiconductor chip, the wet alignment method comprising:
supplying a liquid to a plurality of grooves in a transfer substrate;
supplying a plurality of micro-semiconductor chips onto the transfer substrate; and
aligning the plurality of micro-semiconductor chips with the plurality of grooves by moving a liquid absorber over the plurality of grooves to contact directly with the transfer substrate,
wherein the supplying of the liquid, the supplying of the plurality of micro-semiconductor chips, and the aligning comprise:
soaking the liquid absorber in a suspension comprising the liquid and the plurality of micro-semiconductor chips to affix the plurality of micro-semiconductor chips onto the liquid absorber; and
scanning the transfer substrate by moving the liquid absorber along the plurality of grooves on the transfer substrate, to release the plurality of micro-semiconductor chips from the liquid absorber onto the transfer substrate and to draw the liquid from the plurality of grooves to the liquid absorber.
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