US 12,080,583 B2
Base plate and substrate fixing device
Ken Sato, Nagano (JP); Keiichi Takemoto, Nagano (JP); and Tatsuya Nakamura, Nagano (JP)
Assigned to SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed by SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed on Aug. 17, 2022, as Appl. No. 17/889,521.
Claims priority of application No. 2021-133740 (JP), filed on Aug. 19, 2021.
Prior Publication US 2023/0057110 A1, Feb. 23, 2023
Int. Cl. H01L 21/683 (2006.01)
CPC H01L 21/6833 (2013.01) 10 Claims
OG exemplary drawing
 
1. A base plate having one surface and the other surface opposite to the one surface, an electrostatic chuck being capable of being mounted on the one surface, the base plate comprising:
a refrigerant flow path provided therein,
wherein an inner wall of the refrigerant flow path has an upper surface convex toward the one surface in a longitudinal sectional view in a direction intersecting with a direction in which refrigerant flows, and
wherein an unevenness is formed on the upper surface.