US 12,080,571 B2
Substrate processing module and method of moving a workpiece
Kirankumar Neelasandra Savandaiah, Bangalore (IN); Srinivasa Rao Yedla, Bangalore (IN); and Thomas Brezoczky, Los Gatos, CA (US)
Assigned to APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Jul. 8, 2020, as Appl. No. 16/923,792.
Prior Publication US 2022/0013383 A1, Jan. 13, 2022
Int. Cl. H01L 21/67 (2006.01); C23C 14/35 (2006.01); H01L 21/677 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/67184 (2013.01) [C23C 14/35 (2013.01); H01L 21/67167 (2013.01); H01L 21/67196 (2013.01); H01L 21/67742 (2013.01); H01L 21/67766 (2013.01); H01L 21/68707 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A substrate processing module, comprising:
a shutter disc stack configured to store a plurality of shutter discs, the shutter disc stack comprising:
a stack base; and
a plurality of shutter disc supports coupled to the stack base, each of the plurality of shutter disc supports configured to support a shutter disc;
at least two processing stations;
a transfer robot configured to transfer at least one of the plurality of shutter discs from the shutter disc stack to each of the at least two processing stations; and
one or more walls of the substrate processing module that define a transfer region,
wherein the transfer robot, the shutter disc stack and at least a portion of the at least two processing stations are disposed within the transfer region of the substrate processing module, wherein the at least a portion of the at least two processing stations comprises:
a sealing region comprising a surface of a sealing assembly that is configured to form a seal between a sealing portion of a substrate support and the surface of the sealing assembly.