CPC H01L 21/67115 (2013.01) [H01L 21/324 (2013.01); H01L 21/68742 (2013.01); H01L 21/6875 (2013.01); H01L 21/68757 (2013.01)] | 3 Claims |
1. A support plate for supporting a workpiece in a thermal processing apparatus, the support plate comprising:
a base;
at least one support structure extending from the base, the at least one support structure configured to support the workpiece during thermal processing, the at least one support structure comprises a plurality of support pins;
wherein the base comprises a first portion associated with a first heat transmittance and a second portion associated with a second heat transmittance, the second heat transmittance being higher than the first heat transmittance, wherein the second portion is located proximate to the at least one support structure, the second portion comprises a plurality of circular areas located where the plurality of support pins contact the base, each circular area having a center in the second portion that coincides with a center of a respective support pin of the plurality of support pins, a diameter of each circular area is greater than a diameter of each respective support pin, wherein the first portion is the remaining area of the base excluding the second portion.
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