US 12,080,564 B2
Package substrate processing method
Kazuma Sekiya, Tokyo (JP)
Assigned to DISCO CORPORATION, Tokyo (JP)
Filed by DISCO CORPORATION, Tokyo (JP)
Filed on Apr. 4, 2022, as Appl. No. 17/657,842.
Claims priority of application No. 2021-069360 (JP), filed on Apr. 15, 2021.
Prior Publication US 2022/0336232 A1, Oct. 20, 2022
Int. Cl. H01L 21/56 (2006.01); H01L 21/48 (2006.01)
CPC H01L 21/561 (2013.01) [H01L 21/4853 (2013.01); H01L 21/565 (2013.01)] 3 Claims
OG exemplary drawing
 
1. A package substrate processing method for cutting a package substrate in which devices arranged in regions demarcated by a plurality of intersecting planned dividing lines are sealed by resin, the package substrate processing method comprising:
a holding step of holding the package substrate by a chuck table;
a warp reducing step of, after the holding step is performed, reducing a warp in the package substrate by forming grooves of a first depth along the planned dividing lines of the package substrate by using a first cutting blade;
a groove forming step of, after the warp reducing step is performed, forming grooves of a second depth by further cutting the grooves of the first depth by using the first cutting blade; and
a dividing step of, after the groove forming step is performed, forming packaged chips by further cutting the grooves of the second depth and thus dividing the package substrate by using a second cutting blade thinner than the first cutting blade.