US 12,080,554 B2
Bonding method, bonding device, and holding member
Hajime Mitsuishi, Yokohama (JP); Isao Sugaya, Kawasaki (JP); Minoru Fukuda, Tokyo (JP); Masaki Tsunoda, Kamakura (JP); Hidehiro Maeda, Yokohama (JP); and Ikuhiro Kuwano, Tokyo (JP)
Assigned to NIKON CORPORATION, Tokyo (JP)
Filed by NIKON CORPORATION, Tokyo (JP)
Filed on Apr. 8, 2021, as Appl. No. 17/225,727.
Application 17/225,727 is a division of application No. 16/413,127, filed on May 15, 2019, granted, now 11,004,686.
Application 16/413,127 is a continuation of application No. PCT/JP2017/041366, filed on Nov. 16, 2017.
Claims priority of application No. 2016-223645 (JP), filed on Nov. 16, 2016.
Prior Publication US 2021/0225651 A1, Jul. 22, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/18 (2006.01); B23K 20/00 (2006.01); H01L 21/02 (2006.01); H01L 21/50 (2006.01); H01L 21/67 (2006.01); H01L 21/68 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/185 (2013.01) [B23K 20/002 (2013.01); H01L 21/02 (2013.01); H01L 21/50 (2013.01); H01L 21/67092 (2013.01); H01L 21/67259 (2013.01); H01L 21/681 (2013.01); H01L 21/682 (2013.01); H01L 21/6831 (2013.01); H01L 21/6838 (2013.01); H01L 21/68735 (2013.01)] 39 Claims
OG exemplary drawing
 
1. A bonding method for bonding a first substrate and a second substrate, the bonding method comprising:
forming a protrusion at a partial region of the first substrate held at a holding surface of a holding section;
measuring a position of an alignment mark formed on a front-surface of the first substrate from a front-surface side of the first substrate and a position of an alignment mark formed on a front-surface of the second substrate from a front-surface side of the second substrate after the protrusion is formed in the first substrate and while the first substrate with the protrusion having formed therein and the second substrate are not overlapped with each other; and
bonding the first substrate and the second substrate by contacting at least a part of the protrusion of the first substrate with the front-surface of the second substrate to form a contact region and enlarging the contact region by releasing hold of the first substrate.