CPC H01J 37/32559 (2013.01) [H01J 37/3244 (2013.01); H01J 37/32541 (2013.01); H01J 37/32568 (2013.01); H01J 2237/332 (2013.01)] | 10 Claims |
1. A substrate processing apparatus comprising:
a process chamber configured to provide a reaction space for processing a substrate;
a substrate support configured to support the substrate;
a first electrode installed in the process chamber to face the substrate and having a plurality of protruding electrodes protruding toward the substrate; and
a second electrode positioned beneath the first electrode and having a plurality of insertion holes into which the respective protruding electrodes are inserted, wherein,
each of the insertion holes of the second electrode comprises a first hole at its upper portion, an associated one of the protruding electrodes being inserted into the first hole, and a second hole at its lower portion facing the upper portion,
the first hole has a first opening, and the second hole has a second opening,
wherein the insertion hole comprises:
a first region having a first height and the first opening toward the lower portion from the upper portion of the insertion hole; and
a second region positioned beneath the first region and having a second height and the second opening,
wherein the area of the first opening is smaller than an area of the second opening, and
an area of the first opening at a center of the second electrode is smaller than an area of the first opening at an edge of the second electrode, and
wherein the area of the second opening at a center of the second electrode is equal to the area of the second opening at an edge of the second electrode.
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