US 12,080,524 B2
Semiconductor processing chamber
Yan Li, Beijing (CN); Shixuan Guo, Beijing (CN); and Xingfei Mao, Beijing (CN)
Assigned to BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD., Beijing (CN)
Appl. No. 18/260,662
Filed by BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD., Beijing (CN)
PCT Filed Dec. 23, 2021, PCT No. PCT/CN2021/140702
§ 371(c)(1), (2) Date Jul. 7, 2023,
PCT Pub. No. WO2022/151939, PCT Pub. Date Jul. 21, 2022.
Claims priority of application No. 202110062620.8 (CN), filed on Jan. 18, 2021.
Prior Publication US 2024/0266150 A1, Aug. 8, 2024
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/32522 (2013.01) [H01J 37/3244 (2013.01); H01J 37/32513 (2013.01); H01J 37/32834 (2013.01); H01J 2237/3341 (2013.01); H01J 2237/3348 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A semiconductor processing chamber, comprising:
a chamber having an opening at a top of the chamber;
a housing disposed above the opening;
a dielectric window disposed inside the housing and above the opening;
a coil arranged circumferentially at an inner top wall of the housing;
a hot air hood disposed inside the housing and fixedly attached to the dielectric window, wherein the hot air hood and the inner top wall of the housing are separated by a clearance gap, and the hot air hood includes a heating compartment for heating the dielectric window and at least two air passage ports connected to the heating compartment; and
an air distribution structure being fixedly attached to the housing and including a plurality of air passages, at least two air exchange ports located outside the housing for air intake and air discharge, and at least two transfer ports located inside the housing and respectively connected to the at least two air exchange ports, wherein equal numbers of exchange ports and transfer ports are connected to each other in a one-to-one correspondence.