| CPC H01G 4/005 (2013.01) [H01G 4/224 (2013.01)] | 20 Claims |
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1. A chip capacitor, comprising:
a substrate;
a plurality of capacitor wires on the substrate; and
a mold layer disposed on the substrate to cover the capacitor wires,
wherein each of the capacitor wires comprises:
a core electrode line having a wire shape;
an outer electrode line covering at least a portion of the core electrode line; and
a dielectric line interposed between the core electrode line and the outer electrode line.
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