US 12,080,472 B2
Method to form an inductive component
Pei-I Wei, Hsinchu County (TW); Cheng-Hao Chang, New Taipei (TW); and Shing Tak Li, Hsinchu (TW)
Assigned to CYNTEC CO., LTD., Hsinchu (TW)
Filed by CYNTEC CO., LTD., Hsinchu (TW)
Filed on Sep. 6, 2023, as Appl. No. 18/242,554.
Application 18/242,554 is a continuation of application No. 16/936,435, filed on Jul. 23, 2020, granted, now 11,783,992.
Claims priority of provisional application 62/896,586, filed on Sep. 6, 2019.
Prior Publication US 2024/0006116 A1, Jan. 4, 2024
Int. Cl. H01F 27/29 (2006.01); H01F 17/02 (2006.01); H01F 27/02 (2006.01); H01F 27/28 (2006.01); H01F 41/00 (2006.01); H05K 1/18 (2006.01)
CPC H01F 27/292 (2013.01) [H01F 17/02 (2013.01); H01F 27/022 (2013.01); H01F 27/2828 (2013.01); H01F 41/005 (2013.01); H05K 1/181 (2013.01); H05K 2201/1003 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method to form an inductive component, said method comprising:
providing a metal plate;
forming a metal structure by removing unwanted portions of the metal plate, said metal structure comprising a bare conductor wire, a first electrode and a second electrode, wherein the first electrode and the second electrode are integrally formed with the bare conductor wire, wherein a first thickness of the first electrode is greater than a thickness of the bare conductor wire, and a second thickness of the second electrode is greater than said thickness of the bare conductor wire, wherein a contiguous metal path is formed from a first lateral surface of the first electrode to a second lateral surface of the second electrode via the bare conductor wire; and
forming a magnetic body to encapsulate the bare conductor wire, and at least one portion of the first electrode and at least one portion of the second electrode, wherein the first lateral surface of the first electrode and the second lateral surface of the second electrode are embedded inside the magnetic body.