US 12,080,369 B2
Memory device with modular design and memory system comprising the same
Christopher Cox, San Jose, CA (US); Leechung Yiu, San Jose, CA (US); Robert Xi Jin, San Jose, CA (US); Zheng Qiu, Shanghai (CN); Leonard Datus, San Jose, CA (US); and Lizhi Jin, San Jose, CA (US)
Assigned to MONTAGE ELECTRONICS (SHANGHAI) CO, Shanghai (CN)
Filed by MONTAGE ELECTRONICS (SHANGHAI) CO., LTD., Shanghai (CN)
Filed on Jan. 18, 2022, as Appl. No. 17/577,400.
Claims priority of application No. 202210009086.9 (CN), filed on Jan. 6, 2022.
Prior Publication US 2023/0215474 A1, Jul. 6, 2023
Int. Cl. H05K 1/02 (2006.01); G06F 1/00 (2006.01); G06F 1/10 (2006.01); G06F 13/12 (2006.01); G11C 5/04 (2006.01); H05K 1/18 (2006.01); H05K 5/02 (2006.01)
CPC G11C 5/04 (2013.01) [H05K 1/181 (2013.01); H05K 5/0286 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A memory device, comprising:
a substrate plate having a front edge, a rear edge opposite to the front edge, and a top side and a bottom side which are opposite to each other and extend between the front edge and the rear edge;
an edge connector positioned at the rear edge, positioned on a widthwise direction of the memory device, and configured to connect, in parallel with a lengthwise direction of the memory device, to a host connector of a host device;
a memory control module positioned on one of the top side and the bottom side of the substrate plate;
at least one socket positioned on the top side of the substrate plate and configured to connect to at least one removable memory module; and
a chassis, in which the substrate plate, the memory control module and the at least one socket are enclosed, wherein the chassis comprises an opening through which the edge connector protrudes out of the chassis, and wherein the chassis further comprises an air vent at a front edge of the chassis and is configured to build an air flow across the chassis from the opening to the air vent;
wherein the memory control module is electrically coupled to the edge connector and the at least one socket such that the at least one memory module can be accessible by the host device via the memory control module;
wherein when the at least one memory module is connected to the at least one socket, a lengthwise direction of the at least one memory module is in parallel with the lengthwise direction of the memory device, the at least one memory module is inserted in the memory device in the widthwise direction of the memory device.