US 12,080,368 B2
Circuit module with improved line load
Nan-Chun Lien, Hsinchu County (TW); Li-Wei Chu, Hsinchu County (TW); and Ting-Wei Chang, Hsinchu County (TW)
Assigned to M31 TECHNOLOGY CORPORATION, Hsinchu County (TW)
Filed by M31 TECHNOLOGY CORPORATION, Hsinchu County (TW)
Filed on Jul. 12, 2023, as Appl. No. 18/221,111.
Application 18/221,111 is a continuation of application No. 17/521,894, filed on Nov. 9, 2021, granted, now 11,742,000.
Claims priority of application No. 110128541 (TW), filed on Aug. 3, 2021.
Prior Publication US 2023/0352060 A1, Nov. 2, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G11C 5/02 (2006.01); G11C 7/10 (2006.01)
CPC G11C 5/025 (2013.01) [G11C 7/1057 (2013.01); G11C 7/1084 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A circuit module with improved line load, comprising:
a first line and a second line; and
a middle circuit coupled to the first line, the second line, a first node and a second node; wherein:
during a first interval, the middle circuit conductively routes the first node to the first line not via the second node, conductively routes the first node to the second line via the second node, and thereby causes a voltage of the second line to change when the voltage of the second node changes; and
during a second interval, the middle circuit conductively routes the first node to the first line via the second node, and conductively routes the first node to the second line not via the second node.