US 12,080,331 B2
Memory device having 2-transistor vertical memory cell and shield structures
Kamal M. Karda, Boise, ID (US); Haitao Liu, Boise, ID (US); Karthik Sarpatwari, Boise, ID (US); Durai Vishak Nirmal Ramaswamy, Boise, ID (US); Alessandro Calderoni, Boise, ID (US); Richard E Fackenthal, Carmichael, CA (US); and Duane R. Mills, Shingle Springs, CA (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on May 23, 2023, as Appl. No. 18/200,871.
Application 18/200,871 is a division of application No. 17/186,962, filed on Feb. 26, 2021, granted, now 11,688,450.
Prior Publication US 2023/0298652 A1, Sep. 21, 2023
Int. Cl. G11C 11/404 (2006.01)
CPC G11C 11/404 (2013.01) 10 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a first data line and a second data line;
a first conductive region, and a second conductive region separated from the first conductive region;
a first memory cell including a first transistor and a second transistor, the first transistor including a first channel region coupled between the first data line and the first conductive region, and a first charge storage structure, the second transistor including a second channel region coupled to the first data line and located over the first charge storage structure;
a second memory cell including a third transistor and a fourth transistor, the third transistor including a third channel region coupled between the second data line and the second conductive region, and a second charge storage structure, the fourth transistor including a fourth channel region coupled to the second data line and located over the second charge storage structure;
a conductive line forming a gate of each of the first, second, third, and fourth transistors; and
a conductive structure located between the first and second charge storage structures and electrically separated from the first and second conductive regions.