US 12,080,155 B2
Haptic providing device and method for converting sound signal to haptic signal
Hyeong Jun Kim, Seoul (KR); Jong Hun Lee, Seoul (KR); and In Sik Jee, Seoul (KR)
Assigned to CK MATERIALS LAB CO., LTD., Seoul (KR)
Filed by CK MATERIALS LAB CO., LTD., Seoul (KR)
Filed on Jun. 7, 2023, as Appl. No. 18/330,388.
Application 18/330,388 is a continuation of application No. 17/057,291, granted, now 11,710,389, previously published as PCT/KR2019/011558, filed on Sep. 6, 2019.
Claims priority of application No. 10-2019-0021216 (KR), filed on Feb. 22, 2019; and application No. 10-2019-0021217 (KR), filed on Feb. 22, 2019.
Prior Publication US 2023/0316881 A1, Oct. 5, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G06F 3/16 (2006.01); G06F 3/01 (2006.01); G08B 6/00 (2006.01); G10L 21/06 (2013.01); H04R 3/00 (2006.01); H04S 7/00 (2006.01)
CPC G08B 6/00 (2013.01) [G06F 3/016 (2013.01); G06F 3/165 (2013.01); G10L 21/06 (2013.01); H04R 3/00 (2013.01); H04S 7/30 (2013.01); H04R 2420/07 (2013.01); H04R 2430/01 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A haptic device comprising:
a haptic actuator;
a main body in which the haptic actuator is disposed; and
a sub-body being connected to the haptic actuator to be movable relative to the main body by operation of the haptic actuator,
wherein the haptic actuator comprises:
a housing having an internal space; and
a vehicle movable relative to the housing,
wherein the housing is fixed to the main body,
wherein the vehicle includes a protrusion being connected to the sub-body, and
wherein the haptic device further comprises a cushion placed to surround at least a portion of the housing to attenuate friction sound generated by the housing.