US 12,080,050 B2
Machine learning using a global texture characteristic for semiconductor-based applications
David Kucher, Ann Arbor, MI (US); Sophie Salomon, Ann Arbor, MI (US); and Vijay Ramachandran, Sunnyvale, CA (US)
Assigned to KLA Corp., Milpitas, CA (US)
Filed by KLA Corporation, Milpitas, CA (US)
Filed on Dec. 20, 2021, as Appl. No. 17/557,014.
Prior Publication US 2023/0196732 A1, Jun. 22, 2023
Int. Cl. G06V 10/77 (2022.01); G06N 3/063 (2023.01); G06T 5/50 (2006.01); G06T 7/194 (2017.01); G06T 7/73 (2017.01); G06V 10/54 (2022.01); G06V 10/82 (2022.01)
CPC G06V 10/7715 (2022.01) [G06N 3/063 (2013.01); G06T 5/50 (2013.01); G06T 7/194 (2017.01); G06T 7/73 (2017.01); G06V 10/54 (2022.01); G06V 10/82 (2022.01); G06T 2207/20084 (2013.01); G06T 2207/30148 (2013.01)] 27 Claims
OG exemplary drawing
 
1. A system configured to determine information for a specimen, comprising:
a computer subsystem configured for determining a global texture characteristic of an image of a specimen and one or more local characteristics of a localized area in the image; and
one or more components executed by the computer subsystem, wherein the one or more components comprise a machine learning model configured for determining information for the specimen based on the global texture characteristic and the one or more local characteristics; and
wherein the computer subsystem is further configured for generating results comprising the determined information.