| CPC G06V 10/44 (2022.01) [G06F 16/532 (2019.01); G06F 17/16 (2013.01)] | 20 Claims |
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1. A method for processing a semiconductor wafer, comprising:
obtaining a query image from the semiconductor wafer;
extracting a plurality of patches from the query image;
obtaining a set of weightings according to a plurality of bases of a sparsity-based dictionary, wherein the set of weightings includes a plurality of non-zero weightings;
encoding the patches with the set of weightings to obtain an encoding matrix;
searching the database based on the encoding matrix to retrieve the images corresponding to the query image, wherein each of the images comprises at least one pattern feature of the semiconductor wafer;
using the retrieved images to inspect of defects of the semiconductor wafer, so as to generate an inspection result; and
performing a semiconductor process on the semiconductor wafer when the inspection result is normal;
wherein extracting the patches from the query image further comprises:
obtaining a plurality of sets of the patches from the query image, wherein the plurality of sets of the patches comprises a first set of the patches, a second set of the patches and a third set of the patches;
wherein encoding the patches with the set of weightings to obtain the encoding matrix further comprises:
encoding the first set of the patches with a first set of weightings to obtain a first intermediate matrix;
encoding the second set of the patches with a second set of weightings to obtain a second intermediate matrix, wherein the second set of weightings is obtained by modifying the bases of the sparsity-based dictionary according to the first intermediate matrix;
encoding the third set of the patches with a third set of weightings to obtain a third intermediate matrix, wherein the third set of weightings is obtained by modifying the bases of the sparsity-based dictionary according to the second intermediate matrix; and
assigning the third intermediate matrix as the encoding matrix.
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