US 12,079,557 B2
Nanofabrication and design techniques for 3D ICs and configurable ASICs
Sidlgata V. Sreenivasan, Austin, TX (US); Paras Ajay, Austin, TX (US); Aseem Sayal, Austin, TX (US); Mark McDermott, Austin, TX (US); and Jaydeep Kulkarni, Austin, TX (US)
Assigned to Board of Regents, The University of Texas System, Austin, TX (US)
Appl. No. 17/273,713
Filed by Board of Regents, The University of Texas System, Austin, TX (US)
PCT Filed Sep. 6, 2019, PCT No. PCT/US2019/049875
§ 371(c)(1), (2) Date Mar. 4, 2021,
PCT Pub. No. WO2020/051410, PCT Pub. Date Mar. 12, 2020.
Claims priority of provisional application 62/884,524, filed on Aug. 8, 2019.
Claims priority of provisional application 62/727,886, filed on Sep. 6, 2018.
Prior Publication US 2021/0350061 A1, Nov. 11, 2021
Int. Cl. G06F 30/39 (2020.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); G06F 111/14 (2020.01); G06F 113/18 (2020.01)
CPC G06F 30/39 (2020.01) [H01L 21/67144 (2013.01); H01L 21/6835 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); G06F 2111/14 (2020.01); G06F 2113/18 (2020.01); H01L 2221/68327 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68381 (2013.01); H01L 2225/06544 (2013.01)] 32 Claims
OG exemplary drawing
 
1. A method to fabricate semiconductor devices with die sizes larger than 900 mm2, the method comprising:
providing a first type of source wafers that contain high-resolution circuit elements partitioned into a multitude of pre-fabricated blocks (PFBs), wherein each PFB is at most 900 mm2 in size;
providing a second type of source wafers that contain lower-resolution circuit elements partitioned into a multitude of PFBs, wherein each PFB is at most 1500 mm2 in size;
assembling PFBs from the first type of source wafers onto a product substrate, followed by assembling PFBs from the second type of source wafers onto previously assembled PFBs, wherein the fully-assembled group of high-resolution and low-resolution PFBs is equivalent in function to a monolithically constructed SoC but arbitrarily larger in size than 900 mm2.