US 12,079,479 B2
Memory device with multiple input/output interfaces
Chang H. Siau, Saratoga, CA (US); and Jonathan S. Parry, Boise, ID (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Feb. 15, 2022, as Appl. No. 17/672,026.
Claims priority of provisional application 63/237,924, filed on Aug. 27, 2021.
Prior Publication US 2023/0068580 A1, Mar. 2, 2023
Int. Cl. G06F 3/06 (2006.01)
CPC G06F 3/0611 (2013.01) [G06F 3/0604 (2013.01); G06F 3/0659 (2013.01); G06F 3/0679 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A memory device comprising:
a plurality of plane groups comprising:
a first plane group comprising a first plane of the memory device; and
a second plane group comprising a second plane of the memory device;
a first input/output (I/O) interface configured to access the first plane group;
a second I/O interface configured to access the second plane group;
a multiplexer circuit coupled to the first I/O interface and the second I/O interface, the multiplexer circuit to:
enable the first I/O interface to access the first plane group and the second plane group, and
enable the second I/O interface to access the first plane group and the second plane group; and
a controller operatively coupled to the first I/O interface via a first channel and operatively coupled to the second I/O interface via a second channel, the controller to perform operations comprising:
transmitting, via the first channel to the first I/O interface, a first command to execute a first memory access operation associated with the first plane; and
transmitting, via the second channel to the second I/O interface, a second command to execute a second memory access operation associated with the second plane, wherein the first memory access operation and the second memory access operation are executed concurrently.