US 12,079,046 B2
Bonded hinge structure for an information handling system
Allen B. McKittrick, Cedar Park, TX (US); and Anthony J. Sanchez, Pflugerville, TX (US)
Assigned to Dell Products L.P., Round Rock, TX (US)
Filed by Dell Products L.P., Round Rock, TX (US)
Filed on Jan. 31, 2022, as Appl. No. 17/589,300.
Prior Publication US 2023/0244281 A1, Aug. 3, 2023
Int. Cl. G06F 1/16 (2006.01)
CPC G06F 1/1681 (2013.01) [E05Y 2900/606 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An information handling system comprising:
a cover; and
a bonded hinge assembly bonded to the cover, wherein the bonded hinge assembly includes:
a support frame with a low airflow impedance, the support frame including a notch; and
a hinge including an attachment portion, a rotation portion, and a connector, the attachment portion bonded within the notch of the support frame, wherein the hinge is integrated within the support frame when the hinge is bonded to the support frame, wherein the connector is inserted within the attachment portion, wherein the rotation portion enables the connector to rotate with respect to the attachment portion.