US 12,078,935 B2
Device manufacturing methods
Rizvi Rahman, Eindhoven (NL); Hakki Ergün Cekli, Eindhoven (NL); and Cédric Désiré Grouwstra, Eindhoven (NL)
Assigned to ASML NETHERLANDS B.V., Veldhoven (NL)
Filed by ASML NETHERLANDS B.V., Veldhoven (NL)
Filed on Sep. 9, 2022, as Appl. No. 17/941,378.
Application 17/941,378 is a continuation of application No. 16/620,899, granted, now 11,442,366, previously published as PCT/EP2018/061696, filed on May 7, 2018.
Claims priority of application No. 17175967 (EP), filed on Jun. 14, 2017.
Prior Publication US 2023/0004095 A1, Jan. 5, 2023
Int. Cl. G03F 7/00 (2006.01); G05B 19/418 (2006.01); H01L 21/66 (2006.01)
CPC G03F 7/70191 (2013.01) [G05B 19/41875 (2013.01); H01L 22/20 (2013.01); G05B 2219/45028 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
obtaining a status or measurement data time series relating to conditions existent when a process step of a device manufacturing process was performed on at least some of a plurality of substrates, the data time series comprising data for each of a plurality of different process parameters;
applying a time or smoothing filter to the data time series to obtain filtered data, the applying involving applying a different time or smoothing filter to at least one process parameter of the process parameters than at least one other process parameter of the process parameters;
determining, using the filtered data, (i) a correction to be applied in a subsequent process step performed on a subsequent substrate, (ii) a sampling scheme to be applied to subsequent substrates to generate measurement data, or (iii) both (i) and (ii); and
physically controlling or configuring the device manufacturing process based on the determined correction or sampling scheme and/or applying the determined correction or sampling scheme to control or configure the device manufacturing process.