US 12,078,829 B2
Metal-dielectric optical filter, sensor device, and fabrication method
Georg J. Ockenfuss, Santa Rosa, CA (US); Tim Gustafson, Santa Rosa, CA (US); Jeffrey James Kuna, San Francisco, CA (US); Markus Bilger, Santa Rosa, CA (US); and Richard A. Bradley, Jr., Santa Rosa, CA (US)
Assigned to VIAVI Solutions Inc., Chandler, AZ (US)
Filed by VIAVI Solutions Inc., Chandler, AZ (US)
Filed on Jul. 10, 2023, as Appl. No. 18/349,404.
Application 18/349,404 is a continuation of application No. 17/248,285, filed on Jan. 19, 2021, granted, now 11,782,199.
Application 17/248,285 is a continuation of application No. 16/266,913, filed on Feb. 4, 2019, granted, now 10,928,570, issued on Feb. 23, 2021.
Application 16/266,913 is a continuation of application No. 14/308,343, filed on Jun. 18, 2014, granted, now 10,197,716, issued on Feb. 5, 2019.
Application 14/308,343 is a continuation in part of application No. 13/720,728, filed on Dec. 19, 2012, granted, now 9,448,346, issued on Sep. 20, 2016.
Prior Publication US 2023/0350116 A1, Nov. 2, 2023
Int. Cl. G02B 5/28 (2006.01); G02B 1/10 (2015.01); H01L 27/146 (2006.01)
CPC G02B 5/285 (2013.01) [G02B 1/10 (2013.01); G02B 5/281 (2013.01); G02B 5/283 (2013.01); H01L 27/14621 (2013.01); H01L 27/14685 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
forming, in a photoresist layer and using a development time of 80 seconds to 100 seconds, an overhang by patterning the photoresist layer in a manner that uncovers a region; and
lifting the photoresist layer in a manner that provides a clean lift-off the photoresist layer without breaking a coating that covers the overhang.