US 12,078,791 B2
Method for tilting characterization by microscopy
Jun Liu, Wuhan (CN); Yu Li, Wuhan (CN); Yi Li, Wuhan (CN); Yingfei Wang, Wuhan (CN); Shiyan Wu, Wuhan (CN); and Qiangmin Wei, Wuhan (CN)
Assigned to Yangtze Memory Technologies Co., Ltd., Wuhan (CN)
Filed by Yangtze Memory Technologies Co., Ltd., Hubei (CN)
Filed on Oct. 20, 2021, as Appl. No. 17/451,498.
Application 17/451,498 is a continuation of application No. PCT/CN2021/116411, filed on Sep. 3, 2021.
Prior Publication US 2023/0073472 A1, Mar. 9, 2023
Int. Cl. G02B 21/36 (2006.01); G02B 21/16 (2006.01); H01J 37/26 (2006.01)
CPC G02B 21/367 (2013.01) [G02B 21/16 (2013.01); H01J 37/261 (2013.01); H01J 2237/2802 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method of tilting characterization, the method comprising:
obtaining a first cross section of a product by one selected from the group consisting of ultramicrotomy, cryo ultramicrotomy, focused ion beam, ion etching, tripod polishing or electrochemical processing, wherein the first cross section of the product comprises a horizontal plane and structures formed in a vertical direction on the horizontal plane;
capturing a first image of the first cross section of the product by a microscope to measure a first tilting shift of the structures based on a first disposition of the structures, wherein the first cross section includes the structures of the first disposition;
measuring a second tilting shift of the structures based on a second disposition of the structures by the microscope, the second disposition being a horizontal flip of the first disposition; and
determining a first corrected tilting shift based on the first tilting shift and the second tilting shift.