US 12,078,672 B2
Heat spreaders for use in semiconductor device testing, such as burn-in testing
Xiaopeng Qu, Boise, ID (US); Amy R. Griffin, Boise, ID (US); and Wesley J. Orme, Meridian, ID (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on May 31, 2022, as Appl. No. 17/829,224.
Application 17/829,224 is a continuation of application No. 16/546,648, filed on Aug. 21, 2019, granted, now 11,372,043.
Prior Publication US 2022/0291280 A1, Sep. 15, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. G01R 31/28 (2006.01)
CPC G01R 31/2863 (2013.01) [G01R 31/2875 (2013.01); G01R 31/2879 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A heat spreader configured to be coupled to a burn-in testing board including a plurality of sockets, the heat spreader comprising:
a frame including a plurality of apertures; and
a plurality of heat sinks floatably positioned within corresponding ones of the apertures such that the heat sinks are not fixedly attached to the frame;
wherein, when the heat spreader is coupled to the burn-in testing board, the heat sinks are configured to thermally contact a corresponding one of a plurality of semiconductor devices positioned within the sockets.