CPC G01N 29/2425 (2013.01) [G01N 33/0004 (2013.01)] | 20 Claims |
1. A method, comprising:
bonding a first wafer, composed of a first material, to a second wafer, composed of a second material, in a reference gas atmosphere to form bonded wafers,
wherein a plurality of hermetically sealed cavities are formed,
wherein the plurality of hermetically sealed cavities enclose a reference gas of the reference gas atmosphere; and
singulating the bonded first and second wafers into a plurality of photoacoustic transducers for a photo acoustic detector unit,
wherein each photoacoustic transducer, of the plurality of photoacoustic transducers, comprises a respective hermetically sealed cavity, of the plurality of hermetically sealed cavities, and
wherein each photoacoustic transducer, of the plurality of photoacoustic transducers, is configured to cover an opening of a housing of a photoacoustic detector unit to form an acoustically tight cavity.
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