US 12,078,564 B2
Three-axis sensor, sensor module, and electronic apparatus
Kei Tsukamoto, Tokyo (JP); Ken Kobayashi, Tokyo (JP); Tetsuro Goto, Tokyo (JP); and Yoshiaki Sakakura, Tokyo (JP)
Assigned to Sony Group Corporation, Tokyo (JP)
Appl. No. 17/777,668
Filed by Sony Group Corporation, Tokyo (JP)
PCT Filed Nov. 17, 2020, PCT No. PCT/JP2020/042771
§ 371(c)(1), (2) Date May 18, 2022,
PCT Pub. No. WO2021/100697, PCT Pub. Date May 27, 2021.
Claims priority of application No. 2019-208156 (JP), filed on Nov. 18, 2019.
Prior Publication US 2022/0412825 A1, Dec. 29, 2022
Int. Cl. G01L 5/165 (2020.01); G01L 1/14 (2006.01); G06F 3/041 (2006.01); G06F 3/044 (2006.01)
CPC G01L 5/165 (2013.01) [G01L 1/142 (2013.01); G06F 3/041 (2013.01); G06F 3/044 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A three-axis sensor comprising:
a first detection layer having a first surface, and a second surface on side opposite to the first surface, and including a first sensing section of a capacitive type;
a second detection layer having a first surface opposed to the second surface of the first detection layer, and including a second sensing section of the capacitive type;
a first electrically conductive layer provided to be opposed to the first surface of the first detection layer;
a second electrically conductive layer provided between the first detection layer and the second detection layer;
a separation layer provided between the first detection layer and the second electrically conductive layer to separate the first detection layer and the second electrically conductive layer from each other;
a first deformation layer that is provided between the first electrically conductive layer and the first detection layer, and is elastically deformed in accordance with pressure acting in a thickness direction of a sensor; and
a second deformation layer that is provided between the second electrically conductive layer and the second detection layer, and is elastically deformed in accordance with pressure acting in the thickness direction of the sensor, wherein
a 25% CLD value of the separation layer is 10 or more times a 25% CLD value of the first deformation layer, and
the 25% CLD value of the separation layer is 10 or more times a 25% CLD value of the second deformation layer.