US 12,078,556 B2
Capacitive flexible tactile sensor based on graded inclined micro-cylinder structure
Liangpan Yang, Anhui (CN); Xiaohui Guo, Anhui (CN); Siliang Wang, Anhui (CN); Zhiliang Chen, Anhui (CN); Pengbin Gui, Anhui (CN); Wei Zeng, Anhui (CN); Lixia Yang, Anhui (CN); Yaohua Xu, Anhui (CN); and Zhixiang Haung, Anhui (CN)
Assigned to ANHUI UNIVERSITY, Anhui (CN)
Appl. No. 17/798,087
Filed by ANHUI UNIVERSITY, Anhui (CN)
PCT Filed Dec. 31, 2021, PCT No. PCT/CN2021/144026
§ 371(c)(1), (2) Date Aug. 8, 2022,
PCT Pub. No. WO2023/065540, PCT Pub. Date Apr. 27, 2023.
Claims priority of application No. 202111211504.4 (CN), filed on Oct. 18, 2021.
Prior Publication US 2023/0296453 A1, Sep. 21, 2023
Int. Cl. G01L 1/14 (2006.01)
CPC G01L 1/142 (2013.01) 10 Claims
OG exemplary drawing
 
1. A capacitive flexible tactile sensor based on graded inclined micro-cylindrical structure, including an upper electrode layer, a lower electrode layer and a dielectric layer between them;
the dielectric layer is composed of an upper dielectric layer and a lower dielectric layer, and the upper dielectric layer and the lower dielectric layer are vertically symmetrically distributed in the dielectric layer;
the upper dielectric layer includes an upper dielectric layer base, several upper dielectric layer long micro-cylinders and several upper dielectric layer short micro-cylinders; the upper dielectric layer base is closely bonded to the lower side of the upper electrode layer; the upper dielectric layer long micro-cylinder and the upper dielectric layer short micro-cylinder are staggered and equally spaced at the bottom of the upper dielectric layer base;
the lower dielectric layer includes a lower dielectric layer base, lower dielectric layer long micro-cylinder and lower dielectric layer short micro-cylinder; the lower dielectric layer base is closely bonded to the upper side of the lower electrode layer; the lower dielectric layer long micro-cylinder and the lower dielectric layer short micro-cylinder are staggered and equally spaced at the top of the lower dielectric layer base;
the upper dielectric layer long micro-cylinder and the lower dielectric layer long micro-cylinder are closely bonded, and there is a distance between the upper dielectric layer short micro-cylinder and the lower dielectric layer short micro-cylinder.